Product Update: ES640 Introduces Wafer-Level JS002 CDM Testing Solution
January 18, 2025 – ESDEMC has introduced an update to the JS002 testing option for its ES640 system, adding a wafer-level version with a newly designed discharge probe. The enhancement enables CDM (Charged Device Model) testing on devices with pad sizes down to 50 μm, addressing the needs of advanced semiconductor manufacturing.
Since its release in 2020, the ES640 has supported user-replaceable 250 μm spring probes, Its spring-loaded design also helps reduce the risk of pad damage during testing. In 2023, a 120 μm option was introduced for specific customer needs.
The new wafer-level probe is produced with specialized materials and precision machining, allowing accurate contact on small pads while maintaining waveforms that comply with JS002 standards at 500 V. The new wafer-level probe further extends the flexibility of the system for semiconductor testing applications.
