Tag: MIL-DTL-23659

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ESDEMC Introduces the New ES806 Explosive ESD Testing System

ESDEMC has announced the launch of the upgraded ES806 Explosive ESD Testing System. The new system features a refreshed design and significant improvements in usability, safety, and performance.

Redesigned Interface for Easier Operation

The ES806 now includes a large touchscreen interface, allowing users to conveniently set test voltage polarity, discharge levels, and discharge intervals. The updated design and improved user interaction make testing more efficient.

Pluggable RC Modules for Flexible Configuration

With its new pluggable RC module design, the ES806 allows users to easily switch modules according to testing requirements, supporting a wide range of scenarios. ESDEMC also offers customized RC modules to provide tailored testing solutions.

Enhanced Safety and Functionality

  • High-voltage safety detection: A safety check has been added to the RC module replacement area to ensure operator safety.
  • Emergency Stop: A dedicated emergency stop button allows immediate power cut-off in unexpected situations.
  • Continuous discharge: Adjustable continuous discharge capability supports more complex test requirements.

Safer Layout with Rear High-Voltage Output

The high-voltage output interface has been relocated to the rear panel of the system, reducing operator exposure to high voltage and enhancing overall safety during testing.

Extended Voltage Range

The ES806 supports test voltages up to 50 kV, exceeding the 30 kV range common in similar systems, making it suitable for higher-standard testing requirements.

For more information about the ES806, please visit the ESDEMC product webpage: http://www.esdemc.cn/products/system-level-esd-test/es806-explosive-esd-test-system/

 

 

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ESDEMC Launches Upgraded CC-TLP-1 Probe for Wafer Level and Package Level CC-TLP Testing

ESDEMC announced the release of the upgraded CC-TLP-1 probe, featuring significant improvements in usability and performance for both wafer-level and package-level CC-TLP testing.

Enhanced Design for Easier Operation

The updated CC-TLP-1 probe system introduces:

  • Easy Bed Leveling – A redesigned leveling function that enables faster and more precise alignment between the ground plate and test sample, improving overall testing efficiency.
  • Easy Tip Replacement – Probe tips can now be replaced quickly, allowing users to switch between different tip sizes to meet a wide range of testing requirements.

High-Performance VF-TLP Generator and Accessories

When paired with the ESDEMC ES622 VF-TLP pulse generator, the CC-TLP-1 probe delivers:

  • 0.1 ns rise time
  • 1 ns pulse width

ESDEMC also offers customizable waveform parameters, enabling users to select rise times, pulse widths, and probe tip sizes to suit their specific applications.

Automated Test Software: Test Suite

The CC-TLP-1 works seamlessly with ESDEMC’s Test Suite software, providing an intuitive interface for test configuration, data acquisition, and result analysis. With support for automated test workflows, the software reduces complexity and enhances testing efficiency.

Applications

The CC-TLP-1 probe is designed for both wafer-level and package-level ESD testing and can be applied across semiconductors, integrated circuits, and automotive electronics. From R&D validation to production quality control, the CC-TLP-1 provides reliable data to support a wide range of testing needs.