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TR006 Die level CC-TLP Test Report

CC-TLP head CC-TLP-1

Download or View in PDF: TR006_ Die Level CC-TLP Test Report

This report documents the CC-TLP (Charged Device Model – Transmission Line Pulse) testing performed on Die B at the die level. The purpose of this test is to evaluate the ESD (Electrostatic Discharge) robustness of the device under test (DUT) by applying CC-TLP pulses at various current levels and monitoring the leakage current before and after each pulse.

 

by Keith Miller, Joey Fang, Jared Floyd, Yingjie Gan

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TR002 PV Module Diodes TLP Test Report

SEM image of die surface from ESD damaged PV bypass diode sample, melted metal and silicon observed

Download or View in PDF: TR002_PV Module Diodes TLP Test Report

Bypass and blocking diodes inserted across the strings of the solar panel arrays are found to be susceptible to potential electrostatic discharge (ESD) events. The objective is to explain the theory behind the ESD damage and the proper test and analysis methods for ESD failure of PV module diodes. To demonstrate the proposed test methodology, some diode models supplied by a solar panel arrays manufacturer were evaluated.

 

by Wei Huang, Jerry Tichenor, Yingjie Gan, David Pommerenke,