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Transmission Line Pulse (TLP) Testing

Related Standards:  ANSI/ESD STM5.5.1-2016, IEC 62615:2010

Introduction: Transmission Line Pulse (TLP) testing is a method for semiconductor characterization of Electrostatic Discharge (ESD) protection structures. In the Transmission Line Pulse test, high current pulses are applied to the device under test (DUT) at successively higher levels through a coaxial cable of specified length. The applied pulses are of a current amplitude and duration representative of the Human Body Model (HBM) event (or a Charged Device Model – CDM – event in the case of Very Fast TLP, or VF-TLP). The incident and reflected pulses are evaluated, and a voltage-current (V-I) curve is developed that describes the response of an ESD protection structure to the applied TLP stresses. The Transmission Line Pulse current pulses can be on the order of amps, and the TLP test results can show the turn-on, snap-back, and hold characteristics of the ESD protection structure.

Transmission Line Pulse testing is useful in two very important ways. First, TLP may be used to characterize Input/Output (I/O) pad cells on test chips for new process technologies and Intellectual Property (IP). TLP results are very useful in developing simulation parameters, and for making qualitative comparisons of the relative merit of different ESD protection schemes for innovative pad cell designs. Secondly, TLP may be used as an electrical failure analysis tool, often in combination with conventional, standards-based component ESD testing.

ESDEMC offers a variety of TLP testing services, including Standard TLP, VF-TLP, Long Pulse TLP, Pulsed-SOA, and more.

TLP test services are quoted on a case-by-case basis, based on the scope of the work requested; estimated engineering time to perform the test and customer requested reporting. Please kindly fill out below service requirement form with your test configurations for the quote purpose.

Test Request Form (download) 

Test Capability (customized setup available upon request):

  • Rise Time:
    Standard Options: 0.1 ns,  0.2 ns, 0.5 ns, 1 ns, 2 ns, 5 ns, 10 ns.
    Other options ranging from 40 ps to 1.2 us are available up on request, customer should define in 20-80 % or 10-90 % specifications.
  • Pulse Width:
    Standard Options: 1, 2, 5, 10, 100, 200, 500 ns.
    Other options range from 500 ps to 2000 ns are available up on request.
  • Maximum Pulse Level:
    • TLP & vf-TLP with rise time >= 0.3ns:              100 A into short, (150A coming soon)
    • Vf-TLP with rise time < 0.3 ns:                          40 A into short
    • Vf-TLP with rise time < 0.1 ns:                          20 A into short
  • TLP Test Impedance:
    • 50 Ω for standard TDR-O and TDR-S Setup,
    • 500 Ω or higher available for TLP Setup.