ESDEMC announced the release of the upgraded CC-TLP-1 probe, featuring significant improvements in usability and performance for both wafer-level and package-level CC-TLP testing.

Enhanced Design for Easier Operation

The updated CC-TLP-1 probe system introduces:

• Easy Bed Leveling – A redesigned leveling function that enables faster and more precise alignment between the ground plate and test sample, improving overall testing efficiency.
• Easy Tip Replacement – Probe tips can now be replaced quickly, allowing users to switch between different tip sizes to meet a wide range of testing requirements.

High-Performance VF-TLP Generator and Accessories

When paired with the ESDEMC ES622 VF-TLP pulse generator, the CC-TLP-1 probe delivers:

• 0.1 ns rise time
• 1 ns pulse width

ESDEMC also offers customizable waveform parameters, enabling users to select rise times, pulse widths, and probe tip sizes to suit their specific applications.

Automated Test Software: Test Suite

The CC-TLP-1 works seamlessly with ESDEMC’s Test Suite software, providing an intuitive interface for test configuration, data acquisition, and result analysis. With support for automated test workflows, the software reduces complexity and enhances testing efficiency.

Applications

The CC-TLP-1 probe is designed for both wafer-level and package-level ESD testing and can be applied across semiconductors, integrated circuits, and automotive electronics. From R&D validation to production quality control, the CC-TLP-1 provides reliable data to support a wide range of testing needs.