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ES640 Charged Device Model (CDM) Test System
ES640 Charged Device Model (CDM) Test System
ES640 Charged Device Model (CDM) Test System
ES640 Charged Device Model (CDM) Test System
ES640 Charged Device Model (CDM) Test System
ES640 Charged Device Model (CDM) Test System

ES640 Charged Device Model (CDM) Test System

Charged Device Model (CDM) electrostatic discharge is a common cause of microelectronic circuit failure. Sensitive devices can be seriously damaged or destroyed by a CDM discharge at relatively low voltage. This often occurs when the static charged device contacts a metal surface at a different potential. Such an electrostatic discharge often has an extremely fast rise time.

The Model ES640 is a robotic CDM (Charged Device Model) tester designed to meet all popular CDM ESD test methods, allowing both field induced air discharge methods (FICDM) and relay-based contact discharge methods (LI-CCDM, CC-TLP, RP-CCDM). The system includes a computer, environment-controlled chamber, precision XYZ motion system, different types of CDM tester modules, and an automated test and data analysis software.

Features

  • High resolution cameras (up to 3) allow for easy pin alignment operation
  • High resolution motion control system (down to 1 µm step)
  • Allows multiple devices being tested in a batch
  • Patent-pending CCDM method allows better repeatability
  • Airtight environment chamber increases drying unit efficiency
  • Support regenerative drying unit (no need of nitrogen)
  • No max pin count limitation

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Description

1.    Introduction

Charged Device Model (CDM) electrostatic discharge is a common cause of microelectronic circuit failure. Sensitive devices can be seriously damaged or destroyed by a CDM discharge at relatively low voltage. This often occurs when the static charged device contacts a metal surface at a different potential. Such an electrostatic discharge often has an extremely fast rise time.

The Model ES640 is a robotic CDM (Charged Device Model) tester designed to meet all popular CDM ESD test methods, allowing both field induced air discharge methods (FICDM) and relay based contact discharge methods (LI-CCDM, CC-TLP, RP-CCDM). The system includes a computer, environment-controlled chamber, precision XYZ motion system, different types of CDM tester modules, and an automated test and data analysis software.

Here is a comparison between ESDEMC ES640 CDM Solution to others, including Thermo Scientific Orion3 CDM tester, GTS Scorpion Robotic CDM tester, Hanwa HED-C5000R, TET Model 1100, Fraunhofer EMFT MCDM3.

2.    Features

  • High resolution cameras (up to 3) allow for easy pin alignment operation
  • High resolution motion control system (down to 1 µm step)
  • Allows multiple devices being tested in a batch
  • Patent-pending CCDM method allows better repeatability
  • Airtight environment chamber increases drying unit efficiency
  • Support regenerative drying unit (no need of nitrogen)
  • No max pin count limitation

3.    Applications

  • General charged device model (CDM) system for package and wafer level tests
  • Support many popular latest CDM methods:
    • ANSI/ESDA/JEDEC JS-002 (FICDM)
    • AEC Q100-011 Rev-D (2019 Ver. follows JS-002)
    • AEC Q101-005 Rev-A (2019 Ver. follows JS-002)
    • ANSI/ESD SP5.3.3 (LI-CCDM, vf-TLP required)
    • ANSI/ESD SP5.3.4 (CC-TLP, vf-TLP required)
    • Patent pending RP-CCDM method
    • Legacy and customized solutions available upon request
  • Customizable dimension for robotic CBM (Charged Board Model) and flat panel ESD test

4.    Specifications

Parameters ES640-150 ES640-150 + CP1 Option ES640-300 Units Comments
Max XY Motion Area ≥ 150 X 150 ≥200 X 150 ≥ 300 X 300 mm Probe motion area
Max DUT Area 160 X 160 210 X 200 375 X 425 mm MAX Field plate area for DUT
Field Plate Area 210 X 210 260 X 210 395 X 470 mm Field plate area
Max Z Travel Distance ≥ 50 mm Customizable
Min X, Y, Z Step Size 100 nm
Reposition Repeatability ≤ ±6 μm
Voltage Range ± 5 to ±2000 or ±4000 V Default 2000V, customizable
Min Voltage Step 1 V
Voltage Accuracy ± 1% ±1V % V
XY Vision Resolution 1920 X 1080 Pixel Zoom & Pan
Vertical Vision Resolution 2592 X 1944 Pixel Zoom & Pan
Operating Temperature 10 to 40 (°C)
Operating Humidity 0 to 80 %
Power Supply 120-240 VAC, 50/60 Hz VAC
Power Consumption 300 W
N2 or CDA Pressure 10 – 120 PSI
N2 or CDA Peak Usage 0.2 cfm or 0.34 m3h
300 N2 Tank Avg Usage ~ 19 hour Continuous @ 40RH environment
Desiccant Avg Usage ~ 24 hour Continuous @ 40RH environment

5.    Ordering Information

Line Part # or Option # Description
ES640 Charged Device Model (CDM) Test System
1.1 ES640-150 CDM platform, 150 X 150 mm Test Area, 2 kV
1.2 ES640-150-CP1 Field Plate Upgrade from 150 X 150 to 150 X 200 mm (Larger Test Area)
1.3 ES640-300 CDM platform, 300 X 300 mm Test Area, 2 kV
1.4 ES640-HC Humidity Conditioning Unit (no Nitrogen needed), with desiccant tube *2
(Uses reusable desiccants, lower cost of usage than N2 or CDA)
1.5 ES640-CV4 Charge Voltage Upgrade from 2kV to 4 kV
ANSI/ESDA/JEDEC JS-002 Standard Related Test Solution

(Followed standards include AEC_Q100-011D, AEC_Q101-005A)
2.1 ES640-JS002 JS-002 Solution – System Integration Package

(Including One ES640-JS002-1 Test Fixture)
2.2 ES640-JS002-C JS002/C101 Calibration Disc (6.8 pF and 55 pF)
2.3 ES640-JS002-1 JS-002 Test Fixture #1 (Discharge Tip 250 µm, body diameter 350 µm)
2.4 ES640-JS002-2 JS-002 Test Fixture #2 (Discharge Tip 120 µm, body diameter 200 µm)
2.5 ES640-JS002-6 JS-002 Test Fixture #6 (Discharge Tip 5 µm, body diameter 200 µm), small sharp needle for wafer device
2.6 ES640-JS002-7 JS-002 Test Fixture #7 (Discharge Tip 220 µm, body diameter 300 µm), allowing reaching 4kV TC (voltage factor <=1)
ANSI/ESD S5.3.1-2009 Standard Related Solution

(Not recommend for new designs)
3.1 ES640-S09-F ANSI/ESD S5.3.1-2009_FI-CDM Discharge Unit
3.2 ES640-S09-D ANSI/ESD S5.3.1-2009_D-CDM Discharge Unit
3.3 ES640-S09-C ANSI/ESD FR4 Calibration Module (4 and 30 pF)
3.4 ES640-J13 JEDEC-JESD22-C101F-2013 FI-CDM Discharge Unit
RP-CCDM Contact First CDM Solutions

(New methods for discharge stability improvements, not standardized yet)
4.1 ES640-RPCCDM ESDEMC Patented Contact First CDM Solution

(Very repeatable contact first method, meets JS002 requirement, not require VF-TLP)

(Including one ES640-PRCCDM-P1 Discharge Unit)
4.2 ES640-RPCCDM-P1 RP-CCDM Discharge Unit for Packaged Device
4.3 ES640-RPCCDM-W1 RP-CCDM Discharge Unit for Bare-die & Wafer Device
LI-CCDM Contact First CDM solution
5.1 ES640-LICCDM LI-CCDM Discharge Solution – System Integration Package

(Including one ES640-LICCDM -P1 Discharge unit, require VF-TLP)
5.2 ES640-LICCDM-P1 LI-CCDM Discharge Unit for Packaged Device
5.3 ES640-LICCDM-W1 LI-CCDM Discharge Unit for Bare-die & Wafer Device
5.4 ES640-VFTLP VF-TLP module for CC-TLP or LI-CCDM Method

(This VF-TLP module is a compact VF-TLP for the ES640 system. The default configuration is 1 rise-time + 1 pulse-width with limited expansion capability. If more pulse shape options are needed, model ES622 TLP/VF-TLP is the best option)
CC-TLP Solution
6.1 ES640-CCTLP CC-TLP Solution – System Integration Package

(Including 1 set of ES640-CCTLP-1-50 & calibration gauge)
6.2 CC-TLP-1-50 CC-TLP Discharge Unit with 50mm OD GND Plate
6.3 CC-TLP-1-100 CC-TLP Discharge Unit with 100mm OD GND Plate
6.4 CC-TLP-1-Cal CC-TLP calibration gauge for needle height
Test Fixture Options
7.1 ES640-TF1 Standard CDM test fixture
7.2 ES640-TF2 1mm CDM test fixture
7.3 ES640-TFC Customized CDM test fixture
Third Party Instruments for CDM System
8.1 MISC-OSC1G Digital Oscilloscope (1 GHz bandwidth)
8.2 MISC-OSC6G Digital Oscilloscope (6 GHz bandwidth)

 

Documents

ES640 Charged Device Model (CDM) Test System DATASHEET (PDF)

Software

ES640 Charged Device Model (CDM) Test System Softwares