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ES612A ESD Tester (HBM, HMM, MM)
ES612A ESD Tester (HBM, HMM, MM)
ES612A ESD and Latch-UP Tester (HBM, HMM, MM, LU, TLU, TLP) - Image 3
ES612A ESD and Latch-UP Tester (HBM, HMM, MM, LU, TLU, TLP) - Image 4
HBM Module Front View
HBM Module Back View
ES660 Module
ES612A ESD and Latch-UP Tester (HBM, HMM, MM, LU, TLU, TLP) - Image 8
ES612A ESD and Latch-UP Tester (HBM, HMM, MM, LU, TLU, TLP) - Image 9
ES612A ESD and Latch-UP Tester (HBM, HMM, MM, LU, TLU, TLP) - Image 10
ES612A ESD and Latch-UP Tester (HBM, HMM, MM, LU, TLU, TLP) - Image 11

ES612A ESD and Latch-UP Tester (HBM, HMM, MM, LU, TLU, TLP)

1. Description

 

The ES612A is a versatile and high-performance ESD test system designed for evaluating devices at both the wafer and package levels. It supports industry-standard ESD models including HBM, HMM, and MM. With built-in DC characterization capabilities, the system simplifies the process of determining ESD failure thresholds. For increased flexibility, the ES612A can be expanded with an optional multi-pin relay module, or relay based HBM/MM/LU ATE benchtop expansion module configuration support up to 512 pins, Integrated rack configuration supports up to 2560 pins, making it an ideal solution for comprehensive device qualification and reliability testing.

 

The pulse source design and pulse source delivery method ensure waveform performance directly at the device under test. Current waveforms can be automatically captured and analyzed for each ESD event. In addition, voltage waveforms can be captured and used to determine the turn-on level of protection circuit. They can also be used as a means of failure determination, as the DC characterizations show changes after ESD events.

2. Features

  • Low Parasitic HBM/HMM/MM tester with high quality pulses
  • Very configurable and expandable
  • Robotic-basedautomation unlimited pins, relay-based automation up to 2560 pins, 8 sources
  • External low parasitic pulse module friendly for probe stations
  • Large Touch Panel and Firmware Upgradable
  • Optional Latch-Up test Capability
  • Optional Software Controlled Automated Pulse and Failure Measurement
  • Optional Pulsed IV and static IV Characterization
  • Optional UPS runtime (≥5 min)
  • Latching option supports future upgrade to “Dynamic Latching” and Transient Latch-Up
  • Customize latching module’s test fixture board
  • Pre-/post-HBM I-V Curve Comparison (on same axes)

3. Applications

  • General device level ESD test for wafer, packaged, PCB and system devices
  • HBM module meets ANSI/ESDA/JEDEC JS-001,MIL-STD-883, AEC-Q-101-001, AEC-Q-101-001, AEC-Q100-002, GJB548C and MIL-STD-750
  • HMM module meets ANSI/ESD SP5.6, 50 Ohm method
  • MM module meets ANSI/ESD STM5.2, JEDEC/JESD22-A115
  • Latch-up (LU) meet JEDEC JESD78, AEC-Q100-004
  • Vf-TLP module for fast risetime TLP applications

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Description

1. Description

The ES612A is a versatile and high-performance ESD test system designed for evaluating devices at both the wafer and package levels. It supports industry-standard ESD models including HBM, HMM, and MM. With built-in DC characterization capabilities, the system simplifies the process of determining ESD failure thresholds. For increased flexibility, the ES612A can be expanded with an optional multi-pin relay module, or relay based HBM/MM/LU ATE benchtop expansion module configuration support up to 512 pins, Integrated rack configuration supports up to 2560 pins, making it an ideal solution for comprehensive device qualification and reliability testing.

The pulse source design and pulse source delivery method ensure waveform performance directly at the device under test. Current waveforms can be automatically captured and analyzed for each ESD event. In addition, voltage waveforms can be captured and used to determine the turn-on level of protection circuit. They can also be used as a means of failure determination, as the DC characterizations show changes after ESD events.

The system’s fast speed is achieved by pushing the performance of high/mid speed relays’ control timing to the best. The low parasitic performance is achieved with highly EMC optimized low parasitic PCB and mechanical architecture current return path (GND) design.

2. Features

  • Low Parasitic HBM/HMM/MM tester with high quality pulses
  • Very configurable and expandable
  • Robotic-based automation unlimited pins, relay-based automation up to 2560 pins, 8 sources
  • External low parasitic pulse module friendly for probe stations
  • Large Touch Panel and Firmware Upgradable
  • Optional Latch-Up test Capability
  • Optional Software Controlled Automated Pulse and Failure Measurement
  • Optional Pulsed IV and static IV Characterization
  • Optional UPS runtime (≥5 min)
  • Latching option supports future upgrade to “Dynamic Latching” and Transient Latch-Up
  • Customize latching module’s test fixture board
  • Pre-/post-HBM I-V Curve Comparison (on same axes)

3. Applications

  • General device level ESD test for wafer, packaged, PCB and system devices
  • HBM module meets ANSI/ESDA/JEDEC JS-001,MIL-STD-883, AEC-Q-101-001, AEC-Q-101-001, AEC-Q100-002, GJB548C and MIL-STD-750
  • HMM module meets ANSI/ESD SP5.6, 50 Ohm method
  • MM module meets ANSI/ESD STM5.2, JEDEC/JESD22-A115
  • Latch-up (LU) meet JEDEC JESD78, AEC-Q100-004
  • VF-TLP module for fast risetime TLP applications

4. Specifications

ES612A Controller Options

Parameters ES612A-2K ES612A-4K ES612A-6K ES612A-8K ES612A-12K ES612A-20K ES612A-30K Unit
Output voltage ± 10 ~ 2k ± 10 ~ 4k ± 10 ~ 6k ± 10 ~ 8k ± 10 ~ 12k ± 10 ~ 20k ± 10 ~ 30k V
Output voltage step 1V
Output voltage precision Better than ± 1 % ± 5 V %
Dimensions 347 X 300 X 145 mm
Weight 5 6 6 6 6 7 8 kg
V and I Measurement Passive voltage and current probes
Supported Oscilloscopes Majority models from Keysight, Tektronix, LeCroy.
Supported SMU Keithley 24xx/26xx series SMU.

 External Human Body Model (HBM) Module (Per ANSI/ESDA/JEDEC JS-001)

Parameters HBM-2K HBM-4K HBM-6K HBM -8K HBM -12K HBM -20K HBM-30K Unit
Output voltage ± 10 ~ 2k ± 10 ~ 4k ± 10 ~ 6k ± 10 ~ 8k ± 10 ~ 12k ± 10 ~ 20k ± 10 ~ 30k V
Discharge RC Value C: 100 pF ± 10%, R: 1.5kΩ ± 1%
Short Load Peak Current Ips Per standard ns
Short Load

Rise Time Trs

 2 ≤ Trs ≤ 10 ns
Short Load Decay Time Tds 130 ≤ Tds ≤ 170 ns
Short Load Ringing Irs < 15% of Ips
500 Ω Load Peak Current Ipr Per standard
500 Ω Load Rise Time Trr 5 ≤ Trr ≤ 25 ns
Max Pulse Rate /Pulse Module 10 Standard, 15 Optional P/S
Number of simultaneous pulses >=8
Low parasitic HBM per ANSI/ESDA/JEDEC JS-001-2024/2023 Annex C5 N = 9

 External Human Metal Model (HMM) Module (Per ANSI/ESD SP5.6)

Parameters HMM-12K HMM-24K HMM-36K Unit Comments
HMM first peak current 45 90 135 A 3.75 A per 1 kV ≤ ± 10 %

IEC 61000-4-2 (R=330Ω, C=150pF)
HMM current @ 30 ns 24 48 72 A ≤ ± 10 % (better than ±30% IEC )
HMM current @ 60 ns 12 24 36 A ≤ ± 10 % (better than ±30% IEC )

External Machine Model (MM) Module (Per ANSI/ESD STM5.2)

Parameters MM-2K MM-4K Unit Comments
Output Voltage ±10 ~ 2000 ±10 ~ 4000 V
Discharge RC Value C: 200 pF, R: 0 Ω
Short Load Peak Current Ip1 1.75±10% per 100V A Waveforms above 3kV will no longer exhibit linear increase. Tolerance may be different if socket is used
Short Load Ip2 67% ~ 90% of Ip1 A
Short Load Pulse Period tpm 66 ≤ tpm ≤ 90 ns
500 Ω Load Peak Current Ipr 0.85 – 1.2 A @400V condition per standard
500 Ω Load I100 0.23 – 0.4 A @400V condition per standard
500 Ω Load I200 30 -50% of measured I100 A

ES612-SIV1 Tester Integrated Static IV Module

Parameters ES612-SIV1 Unit Comments
Source Voltage 0 ~ ±40 V
Min Step Size 0.1 V
Accuracy ±1%±50mV Tolerance may be different
Max Source Current 100 mA
Measured Current Accuracy ±1%±40nA

DC & Latch-Up ATE Options (Per JEDEC JS001 & JESD78F)

Parameters ES660-P1-EM1 ES612A–IRC1 ES660-P1-BU ES660-P2-BU Comments
Max Pins 512 2560 1024 2560
Max # of V/I Supplies Up to 7+1 Up to 7+1 Up to 9 + 1 Up to 11 + 1 Additional External Sources

Expansion available
LU Waveform Capture

(Optional)

 Y Y Y Y Integrated DAQ

or External Scope
Relay Matrix Max V DC (V) 500 500 500 500
SSR Matrix Max V DC (V) 100 100 100 100
Max I DC (A) Per Pin 2 2 2 2
Max I DC (A) Per DC Bus 10 10 15 / 10 15 / 10
Default LU Source Vmax (V) >= 100 >= 100 >= 100 >= 100 Current limited to 1 A
Default LU Source Imax (A) >= 10 >= 10 >= 10 >= 10 Voltage limited to 10 V

5. Ordering Information

Line Part # or Option # Description Status
ESD Tester  
1.1 ES612A-2K ES612A ESD Tester, Max 2kV, USB Supported Active
  ES612A-4K ES612A ESD Tester, Max 4kV, USB Supported Active
  ES612A-6K ES612A ESD Tester, Max 6kV, USB Supported Active
  ES612A-8K ES612A ESD Tester, Max 8kV, USB Supported Active
  ES612A-12K ES612A ESD Tester, Max 12kV, USB Supported Active
  ES612A-20K ES612A ESD Tester, Max 20kV, USB Supported Active
  Es612A-30K ES612A ESD Tester, Max 30kV, USB Supported Active
1.2 ES612A-HBM-2 Human Body Model 2 Pin Module, 2kV Active
  ES612A-HBM-4 Human Body Model 2 Pin Module, 4kV Active
  ES612A-HBM-6 Human Body Model 2 Pin Module, 6kV Active
  ES612A-HBM-8 Human Body Model 2 Pin Module, 8kV Active
  ES612A-HBM-12 Human Body Model 2 Pin Module, 12kV Active
  ES612A-HBM-20 Human Body Model 2 Pin Module, 20kV Active
  ES612A-HBM-30 Human Body Model 2 Pin Module, 30kV Active
  HBM-S3 Human Body Model 2 Pin Module, Solid State 3 kV Active
  HBM-S6 Human Body Model 2 Pin Module, Solid State 6 kV Active
  HBM-S10 Human Body Model 2 Pin Module, Solid State 10 kV Coming Soon
1.3 ES612A-HMM-12 Human Metal Model 2 Pin Module, 12kV Equivalent HMM Active
  ES612A-HMM-24 Human Metal Model 2 Pin Module, 24kV Equivalent HMM Active
  ES612A-HMM-36 Human Metal Model 2 Pin Module, 36kV Equivalent HMM Active
1.4 ES612A-MM-2 Machine Model 2 Pin Tester Module, 2kV Active
  ES612A-MM-4 Machine Model 2 Pin Tester Module, 4kV Active
1.5 EPM-VF1 External vf-TLP Pulse Module – 100 ps risetime / 1 ns pulse width

(Expanding vf-TLP Pulse capability for Standard LI-CCDM, CC-TLP applications)

 Active
1.6 EPM-VF2 External vf-TLP Pulse Module – 20/30 ps risetime / 500 ps pulse width

(Expanding vf-TLP Pulse capability for ultra-fast risetime applications)

 Active
Accessories  
2.1 CT-T03-1p0 Current Probe 2kHz to 2 GHz, 1 V/A Active
2.2 HBM-BA1 HBM Board Level Test Accessories Set, Including Cables, Adapters, Calibration Kit and Current Probe Active
2.3 MM-BA1 MM Board Level Test Accessories Set, Including Cables, Adapters, Calibration Kit and Current Probe Active
2.4 ES612A-HBM-WA1 ES612A HBM or MM Wafer Level Test Accessories Set, Including Probe Arms, Needles, and Micro-positioners Active
2.5 ES612A-HMM-WA1 ES612A HMM Wafer Level Test Accessories Set, Including Probe Arms, Needles, and Micro-positioners Active
2.6 CMPS-200A Compact Manual Probe Station Active
2.7 HBM-TC0.3 0.3 mm Pitch Test Clip for Packaged IC Probe Active
2.8 XYZM-PP048 048 Pogo-pin for package level test (pack of 20) Active
2.9 XYZM-TN1 Tungsten Needles – 5 mils sharp tip, for wafer level test (pack of 10) Active
2.10 ES612A-RM1 Rack Mount Kit Active
Third Party  
3.1 KSMU2450 SMU, 200V, 1A, 20W, Single Channel

(For device DC automation failure check))

 Active
3.2 MISC-OSC-1G 1 GHz Bandwidth, 5Gs/S, 4 Channel Oscilloscope Active
3.3 MISC-OSC-200M 200 MHz Bandwidth, 2Gsa/s, 4 Channel Oscilloscope Active
3.4 MISC-OSC-350M 350 MHz Bandwidth, 2Gsa/s, 4 Channel Oscilloscope Active
Automation Solution  
4.1 HBM-RE64X2 64 Pin Relay Expansion Module for HBM Automation Active
4.2 HBM-RE128X2 128 Pin Relay Expansion Module for HBM Automation

(Replaced by ES660-P1-EM1)

 Obsoleted
4.3 HBM-RE256X2 256 Pin Relay Expansion Module for HBM Automation

(Replaced by ES660-P1-EM1)

 Obsoleted
4.4 ES660-P1-EM1 ESD and Latch-up Expansion Module

128 to 512 Pins, Max 8 DC Channels. (No Controller, No High Voltage Power Supply, Require ES612A)

 Active
4.5 ES612A-IRC1 ESD and Latch-up Integrated Rack Configuration

128 to 1024/2560 Pins, Max 8 DC Channels, internal hardware is similar as ES660’s ES660-P1/P2 configurations with less DC channels. Automatic software included.

 Active
4.6 ES62X-PC-SW1 PC included Automation Software for 2-Pin, Pulse & SMU Active
4.7 ES62X-PC-SW2 PC included Automation Software for 2-Pin, Pulse, OSC & SMU Active
4.8 ES62X-PC-SW3 PC included Automation Software for Expansion Module 1 to 1 GND pin test, Pulse, OSC & SMU Active
4.9 ES62X-PC-SW4 PC included Automation Software for Expansion Module 1 to multi GND pins test, Pulse, OSC & SMU Active
4.10 ES650-150 Full Automation 2 Pin Low Parasitic Robotic Automation Solution
(Unlimited Pin, no need of PCB, PC & full-automation software Included)		 Active
DC & Leakage & LU Pulse Source Options
5.1 ES612-SIV1 Tester Integrated Static IV Module

(Allow DUT failure check without SMU and PC)

 Active
5.2   More Source Options, please Refer to ES660 Datasheet Active
Test Socket Options
6.1 S660-P1-DSC1 UT Socket PCB Customized Pin Count Active
6.2   More Test Socket Options, please Refer to ES660 Datasheet Active

 

Documents

ES612A ESD Tester (HBM, HMM, MM, LU, TLU)